Die Attachment Technology
Date: 16 Oct 2017 (Mon)
Time: 9am - 5pm
Venue: sains@usm, Persiaran Bukit Jambul, Bayan Lepas, Penang.
Die attachment is one of the important electronic packaging processes. It enables interconnection between wafer/die and substrate/lead-frame.
In this course, different type of die-attach materials and technologies will be introduce depending on the application of the packaged device. Important processing conditions that may influence the performance of a die attach process and final outcome will also be elaborated.
Effect of temperatures, electrical and mechanical requirements on the material acting as a glue to adhere the die and substrate will also be discussed briefly.
Lastly, selection criteria of a die attach material for certain application will be shared in this course.